xMEMS extends micro cooling fan-on-a-chip tech to AI data centers

xMEMS Labs, a pioneer of monolithic MEMS-based chips, announced that its innovative µCooling fan-on-a-chip platform will be expanded to AI data centers. xAI Supermicro STH 30s Short 3_Music.mp4xMEMS said it will bring the industry’s first in-module active thermal management solution to high-performance optical transceivers. Originally developed for compact mobile devices, xMEMS µCooling now provides targeted, hyper-localized active cooling for dense, thermally-challenged environments inside 400G, 800G, and 1.6Toptical transceivers — a critical yet underserved category in next-gen AI infrastructure. I first heard about them in 2020, when Joseph Jiang, Xmems CEO, talked about the tech behind the chips that enabled chip-based speakers. In the meantime, xMEMS has also announced its “fan on a chip” micro cooling solutions for electronics.